Enthusiast found a thermal interface is used for AMD Ryzen

Subject Internal thermal interface to be used by manufacturers in the production of CPUs actively discussed since then, as the Intel company for most of its chips instead of the beginning of the solder used a special composition of thermal paste. For normal operating conditions this often enough, but when accelerating deterioration of the heat-conducting properties of the binder considerably affects the temperature CPU mode. On the eve of the official launch of AMD Ryzen sales enthusiast Der8auer (Roman Hartung) managed to find out what kind of thermal interface is used for 14-nanometer processors AMD.

The only way to find out the composition of the thermal interface - spend "scalping" by removing the heat-spreading lid of the processor. As it turned out, this is not so simple as in the case of families of Intel LGA115x chips Ivy Bridge / Haswell / Broadwell / Skylake / Kaby Lake. The process requires certain skills and additional equipment. There is already a primitive form, print the 3D-printer, is not enough.

As a result, under the cover eight-Ryzen July 1700 proved to be a low-melting solder. Indium base has a melting temperature of 157c, because you need to remove the cover to warm the chip up to this temperature.



I'm sure many expected that AMD for its new processors will use that solder, which significantly improves the thermal conductivity between the silicon chip and the processor lid. In this case, the CPU temperature regime has largely will depend on the capacity of the cooling system. Pending AMD Ryzen enthusiasts can breathe a sigh of relief - scalping processors will be extremely fun for the brave overclockers, but not the only option to reduce heating overclocked CPU by 20-30 degrees.



tc.ua/news , Original in Russian / На русском